Title:
【発明の名称】加工性,耐熱性の優れた高導電性銅合金
Document Type and Number:
Japanese Patent JP2726939
Kind Code:
B2
Abstract:
There is provided a high-conductivity copper alloy with excellent workability and heat resistance, characterized by the alloy consists essentially of, by weight, at least one element selected from the group consisting of -10-100 ppm In (indium), 10-1000 ppm Ag (silver), -10-300 ppm Cd (cadmium), 10-50 ppm Sn (tin), -10-50 ppm Sb (antimony), 3-30 ppm Pb (lead), -3-30 ppm Bi (bismuth), 3-30 ppm Zr (zirconium), -3-50 ppm Ti (titanium) and 3-30 ppm Hf (hafnium), - and the balance copper. S (sulfur) and O (oxygen) as unavoidable impurities are controlled to amounts of less than 3 ppm S, and less than 5 ppm O, respectively. Other unavoidable impurities are controlled to less than 3 ppm in total amount. The alloy is very suitable for applications such as forming magnet wires and other very thin wires, lead wires for electronic components, lead members for tape automated bonding (TAB) and the like, and members for printed-circuit boards.
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Inventors:
KATO MASANORI
Application Number:
JP5317689A
Publication Date:
March 11, 1998
Filing Date:
March 06, 1989
Export Citation:
Assignee:
NITSUKO KINZOKU KK
International Classes:
C22C9/00; H01B1/02; (IPC1-7): C22C9/00; H01B1/02
Domestic Patent References:
| JP61259558A | ||||
| JP6411931A | ||||
| JP5424811A | ||||
| JP62127436A | ||||
| JP62127437A | ||||
| JP62127438A |
Attorney, Agent or Firm:
Takeshi Imai