Title:
【発明の名称】半導体装置用ヒートシンク
Document Type and Number:
Japanese Patent JP2727957
Kind Code:
B2
Inventors:
HOJO SAKAE
Application Number:
JP4583294A
Publication Date:
March 18, 1998
Filing Date:
March 16, 1994
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L23/36; H01L23/467; H05K7/20; (IPC1-7): H01L23/467; H01L23/36; H05K7/20
Domestic Patent References:
| JP6249700A | ||||
| JP2127796U |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)