Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2729670
Kind Code:
B2
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Inventors:
MATSUGAMI SHOJI
OOTSUKA KANJI
SHIRAI MASAYUKI
OKINAGA TAKAYUKI
EMATA KOJI
OOTSUKA KANJI
SHIRAI MASAYUKI
OKINAGA TAKAYUKI
EMATA KOJI
Application Number:
JP17509589A
Publication Date:
March 18, 1998
Filing Date:
July 06, 1989
Export Citation:
Assignee:
HITACHI SEISAKUSHO KK
HITACHI CHO ERU ESU AI ENJINIARINGU KK
HITACHI CHO ERU ESU AI ENJINIARINGU KK
International Classes:
H01L21/60; H01L23/28; (IPC1-7): H01L23/28; H01L21/60
Domestic Patent References:
| JP6210499U |
Attorney, Agent or Firm:
Tomio Ohinata