Title:
【発明の名称】基板検査装置
Document Type and Number:
Japanese Patent JP2730295
Kind Code:
B2
Abstract:
PURPOSE:To inspect continuity and disconnection without damaging the metal wiring pattern on a substrate to be measured by the use of laser beam. CONSTITUTION:The terminal part of the pattern 11 on a substrate 3 is irradiated with laser beam. When a transparent electrode plate 1 is set to voltage V1 by a power supply 6, the part irradiated with laser beam of a sheet 2 composed of a photoconductive material becomes a continuity state and the pattern 11 becomes V1. After the laser beam is cut off, the power supply 6 is changed over to set the transparent electrode plate 1 to V2. Herein, when the separate terminal of the pattern 11 is irradiated with laser beam, the charge corresponding to (V1-V2) flows when a continuity state is obtained across the terminals and can be detected by an ammeter 5 but, at the time of disconnection, no current flows and the continuity and disconnection of the pattern are judged.
Inventors:
UKITA AKIO
Application Number:
JP493491A
Publication Date:
March 25, 1998
Filing Date:
January 21, 1991
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
G01R31/02; (IPC1-7): G01R31/02
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)