Title:
【発明の名称】高周波半導体用容器
Document Type and Number:
Japanese Patent JP2740294
Kind Code:
B2
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| JPS52156559 | SMALL ELECTRONIC DEVICE PACKAGING PACKAGE |
Inventors:
Kenji Watanabe
Application Number:
JP24552989A
Publication Date:
April 15, 1998
Filing Date:
September 20, 1989
Export Citation:
Assignee:
Yamagata NEC Corporation
International Classes:
H01L23/04; H01L23/02; H01L23/06; (IPC1-7): H01L23/04; H01L23/06
Domestic Patent References:
| JP63200545A | ||||
| JP5613753A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)