Title:
【発明の名称】プリント回路基板の製法
Document Type and Number:
Japanese Patent JP2761981
Kind Code:
B2
Inventors:
Omori Wako
Application Number:
JP7405491A
Publication Date:
June 04, 1998
Filing Date:
March 12, 1991
Export Citation:
Assignee:
Meiki Seisakusho Co., Ltd.
International Classes:
H05K1/02; H05K3/00; H05K1/00; H05K1/11; (IPC1-7): H05K1/02; H05K3/00
Domestic Patent References:
| JP63200592A |
Attorney, Agent or Firm:
Noriaki Goto