Title:
【発明の名称】ワイヤボンディング方法
Document Type and Number:
Japanese Patent JP2767302
Kind Code:
B2
Abstract:
PURPOSE:To detect the contact of a capillary with a bonding face by a method wherein a current or a voltages induced in an ultrasonic oscillator while the capillary is made to descend is detected. CONSTITUTION:A main control device 9 makes a horn 3 swing in a counterclockwise direction about a rockshaft 6 as a center to enable a capillary 1 to descend toward an electrode 11. At this time, an ultrasonic oscillator 7 is not actuated yet. When the capillary 1 comes into contact with the electrode 11 as moving down, the capillary 1 starts oscillating. The oscillation concerned is transmitted to an ultrasonic oscillator 2, and a current flows through the oscillator 2. The current concerned is detected by a current detector 8, which sends a signal to the main control device 9. The device 9 transmits a signal to the ultrasonic oscillator 7, which acutuates the oscillator 2 to execute a bonding operation.
Inventors:
MAEKAWA KATSUMI
Application Number:
JP29195289A
Publication Date:
June 18, 1998
Filing Date:
November 09, 1989
Export Citation:
Assignee:
TOSHIBA MEKATORONIKUSU KK
International Classes:
H01L21/607; H01L21/60; (IPC1-7): H01L21/60; H01L21/607
Domestic Patent References:
| JP391941A | ||||
| JP2278846A | ||||
| JP63191927A | ||||
| JP62154748A | ||||
| JP59106125A | ||||
| JP63197340U | ||||
| JP63142837U |