【発明の名称】半導体装置およびその製造方法

Title:

【発明の名称】半導体装置およびその製造方法

Document Type and Number:

Japanese Patent JP2781020

Kind Code:

B2

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Inventors:

Paul Lin
Mike McShane
Uchida Sugio
Ken Sato

Application Number:

JP23132389A

Publication Date:

July 30, 1998

Filing Date:

September 06, 1989

Export Citation:

Assignee:

Motorola Incorporated
Shinko Electric Industry Co., Ltd.

International Classes:

H01L21/60; G06K19/077; H01L21/56; H01L21/68; H01L23/12; H01L23/28; H01L25/00; (IPC1-7): H01L23/12; H01L25/00

Domestic Patent References:

JPS59208756A

Attorney, Agent or Firm:

Takao Watanuki (1 outside)

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