Title:
【発明の名称】はんだチップの実装方法及び実装装置及び供給装置及び整列装置及び吸着ヘッド及び回路基板
Document Type and Number:
Japanese Patent JP2792596
Kind Code:
B2
Inventors:
KIN HISASHI
Application Number:
JP27254494A
Publication Date:
September 03, 1998
Filing Date:
November 07, 1994
Export Citation:
Assignee:
KYANON DENSHI KK
International Classes:
B23K3/00; B23K3/06; H01L21/60; H05K3/34; (IPC1-7): H01L21/60; H01L21/321; H05K3/34
Domestic Patent References:
| JP6291122A | ||||
| JP3241846A | ||||
| JP52115176A | ||||
| JP4269834A | ||||
| JP6052045A |
Attorney, Agent or Firm:
Yasunori Otsuka (1 person outside)