Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2799731
Kind Code:
B2
Inventors:
Tetsuo Uchiyama
Yoshinori Hoshino
Mitsuhiro Yamada
Yoshinori Hoshino
Mitsuhiro Yamada
Application Number:
JP14057189A
Publication Date:
September 21, 1998
Filing Date:
June 01, 1989
Export Citation:
Assignee:
株式会社日立製作所
株式会社日立超エル・エス・アイ・システムズ
株式会社日立超エル・エス・アイ・システムズ
International Classes:
H05K3/24; H01L21/3205; H01L21/60; H01L21/768; H01L23/522; (IPC1-7): H01L21/60; H01L21/60; H01L21/768; H05K3/24
Domestic Patent References:
| JP60111421A | ||||
| JP5326691A | ||||
| JP2172221A |
Attorney, Agent or Firm:
Tomio Ohinata