Title:
【発明の名称】冷却手段を備えた半導体素子、およびそれを用いた装置
Document Type and Number:
Japanese Patent JP2807055
Kind Code:
B2
Abstract:
PURPOSE:To prevent temperature rise of an element body to be heated, to reduce thermal expansion coefficient, and to reduced a thermal stress at the connecting boundary of parts by supplying cooling material to a cooling material passage of a cooling board to forcibly cool the body. CONSTITUTION:A cooling board 10 is formed with a cooling material passage 12 therein by connecting two metal plates 10A, 10B and forming a continuous protrusion of a semicircular section at one plate 10B, and the passage 12 is formed in a U shape opened at both ends. Only both ends of the passage 12 are expanded in a circular section in a predetermined length, a connecting pipe 14 made of copper, etc., is inserted thereinto, and brazed by a silver brazing material. A supply tube 28 is connected to the pipe 14 through a joint 30, and liquefied fluorocarbon gas, pure water, coolant such as various liquids are supplied from a refrigerant supplying mechanism. The coolant is fed to the passage 12 to forcibly cool a semiconductor chip 18 which generates heat.
Inventors:
Shuntaro Tatsuta
Atsushi Koike
Yatsushiro Kazushi
Masukawa
Suhide Sato
Atsushi Koike
Yatsushiro Kazushi
Masukawa
Suhide Sato
Application Number:
JP17193390A
Publication Date:
September 30, 1998
Filing Date:
June 29, 1990
Export Citation:
Assignee:
Mitsubishi Shindoh Co., Ltd.
International Classes:
H01L23/473; (IPC1-7): H01L23/473
Domestic Patent References:
| JP63132462A | ||||
| JP62142021A |
Attorney, Agent or Firm:
Masatake Shiga (2 outside)