Title:
【発明の名称】エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP2812173
Kind Code:
B2
Inventors:
Satoshi Okuse
Koji Nimori
Toshio Shiobara
Koji Nimori
Toshio Shiobara
Application Number:
JP34861993A
Publication Date:
October 22, 1998
Filing Date:
December 27, 1993
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L63/00; C08K3/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08K3/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP559264A | ||||
| JP567701A | ||||
| JP63202614A | ||||
| JP567700A |
Attorney, Agent or Firm:
Takashi Kojima