Title:
【発明の名称】半導体パッケージ
Document Type and Number:
Japanese Patent JP2820133
Kind Code:
B2
Inventors:
Yoshiro Norio
Application Number:
JP24303196A
Publication Date:
November 05, 1998
Filing Date:
September 13, 1996
Export Citation:
Assignee:
NEC
International Classes:
H05K1/18; H01L23/48; H01L23/50; H05K3/22; H05K3/34; (IPC1-7): H01L23/50; H05K1/18
Domestic Patent References:
| JP60206056A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)