Title:
【発明の名称】光半導体封止用エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP2820540
Kind Code:
B2
More Like This:
Inventors:
Hiroshi Shimawaki
Tomohito Otsuki
Tomohito Otsuki
Application Number:
JP41831590A
Publication Date:
November 05, 1998
Filing Date:
December 27, 1990
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/20; C08G59/32; H01L23/29; H01L23/31; (IPC1-7): C08G59/32; H01L23/29; H01L23/31
Domestic Patent References:
| JP2222165A | ||||
| JP1152119A | ||||
| JP62207320A | ||||
| JP62203636A | ||||
| JP394454A | ||||
| JP62138521A |