Title:
【発明の名称】制振性樹脂組成物及びその複合材
Document Type and Number:
Japanese Patent JP2823909
Kind Code:
B2
More Like This:
JPS58173149 | EPOXY RESIN COMPOSITION |
JPH03115455 | SEALING RESIN COMPOSITION AND RESIN-SEALED SEMICONDUCTOR DEVICE |
WO/2012/044443 | EPOXY RESIN COMPOSITIONS |
Inventors:
Shinya Onishi
Nobuhiro Nogami
Shinonome
Teruaki Fujii
Hideyuki Iitani
Koichi Nagakura
Nobuhiro Nogami
Shinonome
Teruaki Fujii
Hideyuki Iitani
Koichi Nagakura
Application Number:
JP31285989A
Publication Date:
November 11, 1998
Filing Date:
December 01, 1989
Export Citation:
Assignee:
UNITIKA LTD.
Ube Industries,Ltd.
Ube Industries,Ltd.
International Classes:
C08L63/00; B32B27/36; B32B27/38; C08G59/00; C08G59/42; C08L67/00; (IPC1-7): C08L63/00; B32B27/36; B32B27/38; C08G59/42; C08L67/00
Domestic Patent References:
JP1153746A | ||||
JP63202446A | ||||
JP63278845A | ||||
JP1198622A | ||||
JP6264854A |
Attorney, Agent or Firm:
Ippei Watanabe (2 outside)