Title:
【発明の名称】半導体封止用樹脂組成物
Document Type and Number:
Japanese Patent JP2828784
Kind Code:
B2
More Like This:
Inventors:
TAKASU NOBUTAKA
TOZAKI EIZO
TOZAKI EIZO
Application Number:
JP41920690A
Publication Date:
November 25, 1998
Filing Date:
December 14, 1990
Export Citation:
Assignee:
SUMITOMO BEEKURAITO KK
International Classes:
C08G59/62; C08G59/00; C08K3/00; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; C08K3/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP44514A | ||||
| JP60243113A | ||||
| JP6426624A | ||||
| JP6230118A | ||||
| JP3265623A |