Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP2840232
Kind Code:
B2
Inventors:
FUNAKOSHI HISASHI
OCHI TAKAO
HATADA KENZO
WAKABAYASHI TAKASHI
OCHI TAKAO
HATADA KENZO
WAKABAYASHI TAKASHI
Application Number:
JP12823297A
Publication Date:
December 24, 1998
Filing Date:
May 19, 1997
Export Citation:
Assignee:
MATSUSHITA DENKI SANGYO KK
International Classes:
H01L21/52; H01L23/50; (IPC1-7): H01L23/50; H01L21/52
Attorney, Agent or Firm:
Hiroshi Maeda (2 outside)