Title:
【発明の名称】ウェーハの研磨方法
Document Type and Number:
Japanese Patent JP2849533
Kind Code:
B2
Abstract:
A template-type wafer polishing method in which a plurality of wafers are polished while they are fitted in the corresponding number of circumferentially spaced engagement holes in a template blank, with the backsides of the respective wafers held by a backing pad, wherein the backing pad has, in its one surface next to the template blank, a plurality of annular grooves each extending along a corresponding one of the engagement grooves in the template blank for relieving a stress concentrated on the peripheral edge of each wafer. The polished wafer is free from deformation, such as declination caused at the peripheral edge thereof due to stress concentration and, hence, has an extremely high degree of flatness. The backing pad and a method of making the same are also disclosed.
Inventors:
NAKAJIMA YUKIO
KUROYANAGI ITSUO
KUROYANAGI ITSUO
Application Number:
JP20409893A
Publication Date:
January 20, 1999
Filing Date:
August 18, 1993
Export Citation:
Assignee:
NAGANO DENSHI KOGYO KK
SHINETSU HANDOTAI KK
SHINETSU HANDOTAI KK
International Classes:
B24B1/00; B24B37/04; B24B37/30; H01L21/304; H01L21/683; (IPC1-7): H01L21/304; B24B1/00; B24B37/04; H01L21/68
Attorney, Agent or Firm:
Shoji Ishihara