Title:
【発明の名称】半導体または半導体部品の保存方法
Document Type and Number:
Japanese Patent JP2850405
Kind Code:
B2
Inventors:
INOE YOSHIAKI
HARIMA YOSHIHIKO
MURABAYASHI SHIGERU
HARIMA YOSHIHIKO
MURABAYASHI SHIGERU
Application Number:
JP27372789A
Publication Date:
January 27, 1999
Filing Date:
October 23, 1989
Export Citation:
Assignee:
MITSUBISHI GASU KAGAKU KK
International Classes:
B65D85/86; B65D73/02; B65D81/24; B65D85/38; H01L23/00; (IPC1-7): B65D81/24; B65D85/86
Domestic Patent References:
| JP1139380A | ||||
| JP62294544A |