Title:
【発明の名称】圧接形半導体装置
Document Type and Number:
Japanese Patent JP2851031
Kind Code:
B2
Inventors:
YOSHIOKA KINJI
Application Number:
JP33621495A
Publication Date:
January 27, 1999
Filing Date:
November 29, 1995
Export Citation:
Assignee:
TOYO DENKI SEIZO KK
International Classes:
H01L29/74; H01L21/52; (IPC1-7): H01L21/52