【発明の名称】半導体装置の製造方法

Title:

【発明の名称】半導体装置の製造方法

Document Type and Number:

Japanese Patent JP2870872

Kind Code:

B2

Inventors:

SATO JUNICHI
GOCHO TETSUO

Application Number:

JP27793089A

Publication Date:

March 17, 1999

Filing Date:

October 25, 1989

Export Citation:

Assignee:

SONII KK

International Classes:

H01L21/76; H01L21/302; H01L21/3065; H01L21/31; (IPC1-7): H01L21/76; H01L21/3065; H01L21/31

Domestic Patent References:

Attorney, Agent or Firm:

Hideaki Ogawa

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