Title:
【発明の名称】樹脂封止半導体装置
Document Type and Number:
Japanese Patent JP2880337
Kind Code:
B2
Inventors:
OKUAKI YUTAKA
Application Number:
JP26656691A
Publication Date:
April 05, 1999
Filing Date:
October 16, 1991
Export Citation:
Assignee:
OKI DENKI KOGYO KK
International Classes:
H01L23/28; H01L23/50; (IPC1-7): H01L23/50; H01L23/28
Domestic Patent References:
| JP4324663A | ||||
| JP62252159A | ||||
| JP63252455A | ||||
| JP6457651A | ||||
| JP6466959A | ||||
| JP2294060A |
Attorney, Agent or Firm:
Mamoru Shimizu (3 outside)