Title:
【発明の名称】電子デバイス用接着剤
Document Type and Number:
Japanese Patent JP2880875
Kind Code:
B2
Abstract:
PURPOSE:To improve the reliability of an electronic device by using an adhesive having a high thermal conductivity so as to improve heat dissipation of the electronic device and preventing strain between inner constituting components or breakage thereof caused by generated thermal stress. CONSTITUTION:There is provided an adhesive 1 for an electronic device, composed of a filler 2 such as carbon fibers mutually independent and continuous in the direction of the heat-conducting pass and a matrix 3 composed of an uncured or semi-cured resin and supplied in the form of sheet or film. This adhesive 1 is hardened by heating to bond an electronic device 4 to a heat sink 5.
Inventors:
KAGA YUKARI
Application Number:
JP8368593A
Publication Date:
April 12, 1999
Filing Date:
April 12, 1993
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
C09J11/00; C09J11/08; C09J201/00; H01L23/36; H01L23/373; H01L23/40; (IPC1-7): C09J11/00; C09J11/08; H01L23/36; H01L23/40
Domestic Patent References:
| JP553462A | ||||
| JP60144378A | ||||
| JP6369883A | ||||
| JP5179210A | ||||
| JP6212137A | ||||
| JP6452247U | ||||
| JP5528220B2 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)