Title:
【発明の名称】半導体装置のリード矯正方法および半導体装置の実装方法
Document Type and Number:
Japanese Patent JP2880877
Kind Code:
B2
Inventors:
NISHIKAWA HIDEYUKI
Application Number:
JP12806293A
Publication Date:
April 12, 1999
Filing Date:
April 30, 1993
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/56; H01L23/50; H05K3/34; (IPC1-7): H01L23/50; H01L21/56; H05K3/34
Domestic Patent References:
| JP4116856A | ||||
| JP541577A | ||||
| JP3209749A | ||||
| JP61123536U |
Attorney, Agent or Firm:
Naoki Kyomoto