Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2885758
Kind Code:
B2
Inventors:
HABASAKI TADAYUKI
Application Number:
JP7338297A
Publication Date:
April 26, 1999
Filing Date:
March 26, 1997
Export Citation:
Assignee:
NIPPON DENKI AISHII MAIKON SHISUTEMU KK
International Classes:
H01L27/04; H01L21/822; (IPC1-7): H01L27/04; H01L21/822
Domestic Patent References:
| JP4177871A | ||||
| JP258367A | ||||
| JP6298763A | ||||
| JP6240757A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)