Title:
【発明の名称】高周波電力用半導体装置
Document Type and Number:
Japanese Patent JP2889213
Kind Code:
B2
Inventors:
ISHIKAWA OSAMU
YOKOYAMA TAKAHIRO
KUNIHISA TAKETO
ITO JUNJI
NISHIJIMA MASAAKI
YAMAMOTO SHINJI
FUJIWARA TOSHIO
MURAMATSU KAORU
YOKOYAMA TAKAHIRO
KUNIHISA TAKETO
ITO JUNJI
NISHIJIMA MASAAKI
YAMAMOTO SHINJI
FUJIWARA TOSHIO
MURAMATSU KAORU
Application Number:
JP24113297A
Publication Date:
May 10, 1999
Filing Date:
September 05, 1997
Export Citation:
Assignee:
MATSUSHITA DENKI SANGYO KK
International Classes:
H01L21/52; H01L23/12; H01L23/28; H01L23/50; (IPC1-7): H01L23/50; H01L23/12; H01L23/28
Domestic Patent References:
| JP54124678A | ||||
| JP6112398A |
Attorney, Agent or Firm:
Hiroshi Maeda (2 outside)