【発明の名称】半導体装置の製造方法

Title:

【発明の名称】半導体装置の製造方法

Document Type and Number:

Japanese Patent JP2891952

Kind Code:

B2

Inventors:

KASAI MASARU
ONODA TOSHASU
FUKUDA JOJI

Application Number:

JP33667096A

Publication Date:

May 17, 1999

Filing Date:

December 17, 1996

Export Citation:

Assignee:

SHIBAURA MEKATORONIKUSU KK

International Classes:

H01L21/28; H01L21/302; H01L21/3065; H01L21/3205; H01L21/768; (IPC1-7): H01L21/3205; H01L21/28; H01L21/3065; H01L21/768

Domestic Patent References:

JP5175170A

Attorney, Agent or Firm:

Kazuo Sato (3 others)

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