Title:
【発明の名称】電子素子過熱しゃ断構造
Document Type and Number:
Japanese Patent JP2905171
Kind Code:
B2
Inventors:
KO KENYOKU
Application Number:
JP11802897A
Publication Date:
June 14, 1999
Filing Date:
May 08, 1997
Export Citation:
Assignee:
KO KENYOKU
International Classes:
H01H37/76; H01H85/04; (IPC1-7): H01H37/76
Domestic Patent References:
| JP53623A | ||||
| JP660047U |
Attorney, Agent or Firm:
Shintaro Nogawa