Title:
【発明の名称】フラット型半導体レーザモジュール
Document Type and Number:
Japanese Patent JP2910642
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce the height of a flat type semiconductor laser module so as to reduce the space occupied by the module. SOLUTION: In a flat type semiconductor laser module provided with a semiconductor laser 14 which emits laser light, an optical fiber 17, a lens 15 which condenses the light emitted from the laser 14 into a beam and couples the beam to the core of the fiber 17, and a flat type package which houses the laser 14 and lens 15, the core of the fiber 17 is positioned to a level lower than that of the laser light emitting point of the laser 14 by using the bottom face of the package 11 as a reference. To be concrete, the light emitted from the laser 14 is condensed into a beam through the lens 15 and, at the same time, the condensed beam is directed downward. The end face of the fiber 17 is cut obliquely against the center line of the fiber 17 so that the normal line to the end face can be directed downward. In another constitution of the laser module, two lenses of a lens which condenses the light into a beam and another lens which is positioned to a level lower than that of the condenser lens, further condenses the beam, and couples the condensed beam to an optical fiber are provided.
Inventors:
SHIMIZU HARUHITO
Application Number:
JP27081995A
Publication Date:
June 23, 1999
Filing Date:
October 19, 1995
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01S5/00; H01S5/022; (IPC1-7): H01S3/18
Domestic Patent References:
| JP5224100A | ||||
| JP5150146A | ||||
| JP521456U |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)