Title:
【発明の名称】リードフレームに液状の接着剤を塗布して形成された不連続的な接着層を有するリードオンチップ半導体パッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP2914624
Kind Code:
B2
Abstract:
A lead-on-chip semiconductor device package is formed by attaching a lead frame to the chip with a discontinuous adhesive layer. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive material having a certain viscosity. Although the liquid adhesive is continuously applied to top surfaces of the inner leads as well as gaps between adjacent inner leads, the adhesive layer is formed only on the top surfaces of the inner leads while the liquid adhesive falls through the gaps. Thermoplastic or thermosetting resins may be used as the liquid adhesive.
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| JP2997367 | [Title of Invention] Package for storing semiconductor elements |
Inventors:
SO EISAI
JO JEONJU
YASU SHOKO
KO SANJO
JO JEONJU
YASU SHOKO
KO SANJO
Application Number:
JP10576297A
Publication Date:
July 05, 1999
Filing Date:
April 23, 1997
Export Citation:
Assignee:
SANSEI DENSHI KK
International Classes:
H01L23/18; H01L23/495; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP5218111A | ||||
| JP6291152A | ||||
| JP8195468A |
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)