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Title:
【発明の名称】半導体素子収納用パッケージ
Document Type and Number:
Japanese Patent JP2942424
Kind Code:
B2
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Inventors:
SATSUNAI TAKASHIGE
IWATA YASUTOSHI
Application Number:
JP29248292A
Publication Date:
August 30, 1999
Filing Date:
October 30, 1992
Export Citation:
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Assignee:
KYOSERA KK
International Classes:
H01L23/02; H01L23/08; H05K5/00; (IPC1-7): H01L23/02; H01L23/08
Domestic Patent References:
JP1104729U
Attorney, Agent or Firm:
Yukio Ono (1 person outside)



 
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