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Title:
【発明の名称】銅層とセラミックとの間に強力な結合を作り出す方法
Document Type and Number:
Japanese Patent JP2944215
Kind Code:
B2
Abstract:
PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of

Inventors:
KYUUN HAINRITSUHI
BOSU URURIHI
HANSU KARUSUTEN
FUON KAIZAA KARURUUFURIIDORITSUHI
Application Number:
JP51703293A
Publication Date:
August 30, 1999
Filing Date:
March 19, 1993
Export Citation:
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Assignee:
HEKISUTO AG
International Classes:
C04B41/51; C04B41/88; C23C4/08; H01L21/48; H05K3/14; (IPC1-7): C23C4/12; C04B41/88; C23C4/08
Domestic Patent References:
JPS6459887A1989-03-07
JPH0385715A1991-04-10
JPS61230761A1986-10-15
JPS6247470A1987-03-02
JPS61231155A1986-10-15
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)



 
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