Title:
【発明の名称】半導体装置の電極形成方法と実装方法
Document Type and Number:
Japanese Patent JP2953111
Kind Code:
B2
Abstract:
PURPOSE:To provide the electrode structure and the mounting structure, of a semiconductor device, wherein the semiconductor device and a circuit board can be connected easily and with good reliability. CONSTITUTION:In a mounting method, the upper part of an aluminum electrode pad 2 on an IC substrate 1 for a semiconductor device is provided with a protrusion-shaped bump electrode 3, a low-melting-point alloy foil 5 is brought into contact with the top part of the bump electrode 3, the IC substrate 1 is heated, a low-melting-point alloy bonded layer 8 is formed only on the bump electrode 3 and the semiconductor device is connected electrically to a terminal electrode on the circuit board via the bonded layer 8. When the bonded layer is formed by a transfer operation, it is possible to avoid the contamination of the semiconductor device, the spread of the bonded layer can be regulated by the protrusion-shaped bump electrode 3, and a bonding operation at a fine pitch can be realized.
Inventors:
BETSUSHO YOSHIHIRO
NAKATANI SEIICHI
NAKATANI SEIICHI
Application Number:
JP14586891A
Publication Date:
September 27, 1999
Filing Date:
June 18, 1991
Export Citation:
Assignee:
MATSUSHITA DENKI SANGYO KK
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60; H01L21/60
Domestic Patent References:
| JP63119552A | ||||
| JP362936A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)