Title:
【発明の名称】回路素子接合部の検査方法
Document Type and Number:
Japanese Patent JP2960301
Kind Code:
B2
Inventors:
NAKADA SHUJI
SHIMIZU YOSHIMASA
SHIMIZU YOSHIMASA
Application Number:
JP14497094A
Publication Date:
October 06, 1999
Filing Date:
June 27, 1994
Export Citation:
Assignee:
NAKADA SHUJI
DENYOO KK
DENYOO KK
International Classes:
H01L21/66; H01L21/60; (IPC1-7): H01L21/66
Domestic Patent References:
| JP59202048A | ||||
| JP63305238A | ||||
| JP685027A |
Attorney, Agent or Firm:
Kazuo Sato (3 others)