Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2970206
Kind Code:
B2
Inventors:
IYODA MORITAKA
Application Number:
JP11888292A
Publication Date:
November 02, 1999
Filing Date:
May 12, 1992
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L23/34; H01L23/50; (IPC1-7): H01L23/50; H01L23/34
Domestic Patent References:
| JP5253670A | ||||
| JP62144346A | ||||
| JP63293931A | ||||
| JP5465665U | ||||
| JP64301U |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)