Title:
【発明の名称】半導体集積回路装置
Document Type and Number:
Japanese Patent JP2990804
Kind Code:
B2
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Inventors:
HIROTA MASAKI
Application Number:
JP40538090A
Publication Date:
December 13, 1999
Filing Date:
December 05, 1990
Export Citation:
Assignee:
NITSUSAN JIDOSHA KK
International Classes:
H01L21/3205; H01L21/8234; H01L23/52; H01L27/088; H01L29/78; (IPC1-7): H01L21/8234; H01L21/3205; H01L27/088
Attorney, Agent or Firm:
Fuyuki Nagai