【発明の名称】半導体装置の製造方法

Title:

【発明の名称】半導体装置の製造方法

Document Type and Number:

Japanese Patent JP2991386

Kind Code:

B2

Inventors:

KUROI TAKASHI

Application Number:

JP41068990A

Publication Date:

December 20, 1999

Filing Date:

December 13, 1990

Export Citation:

Assignee:

MITSUBISHI DENKI KK

International Classes:

H01L29/73; H01L21/265; H01L21/331; H01L21/8238; H01L27/092; H01L29/732; (IPC1-7): H01L21/265; H01L21/8238; H01L27/092

Domestic Patent References:

Attorney, Agent or Firm:

Kenichi Hayase

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