Title:
【発明の名称】感熱孔版原紙
Document Type and Number:
Japanese Patent JP3011958
Kind Code:
B2
Abstract:
PCT No. PCT/JP90/00567 Sec. 371 Date Dec. 6, 1991 Sec. 102(e) Date Dec. 6, 1991 PCT Filed Apr. 27, 1990 PCT Pub. No. WO91/13766 PCT Pub. Date Sep. 19, 1991.A thermosensitive stencil paper contains a main component layer formed of a thermoplastic film and an ink-permeable support bonded together with adhesive, in which the ink-permeable support is a porous thin paper containing polynosic fibers as the main fibrous component. Optionally, the thermosensitive stencil paper has a plastic film layer whose surface is coated with a mold release layer containing as a main component a silicone oil having a kinematic viscosity of 500,000 cs or more. The transfer operation of the stencil paper in an automatic printer is excellent and its ink feeding performance during printing is high because of the polynosic fiber-containing porous thin paper support. Nonprinted spot defects are reduced because of the small number of bundled fibers in the stencil paper. Stencil paper containing the mold release layer are free of offsetting when rolled and cause no sticking for a long period of time, thereby providing thermosensitive stencil paper with excellent performance.
Inventors:
Yukihiro Terada
Toshihiro Asai
Toshihiro Asai
Application Number:
JP6092890A
Publication Date:
February 21, 2000
Filing Date:
March 14, 1990
Export Citation:
Assignee:
Kojin Co., Ltd.
International Classes:
B41N1/24; (IPC1-7): B41N1/24
Domestic Patent References:
| JP3161396A | ||||
| JP2171294A | ||||
| JP1238992A | ||||
| JP1237196A | ||||
| JP1234294A |