Title:
【発明の名称】配線基板用エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP3017562
Kind Code:
B2
Inventors:
Osamu Kiyohara
Application Number:
JP14406591A
Publication Date:
March 13, 2000
Filing Date:
May 21, 1991
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
C08G59/40; C08G59/00; C08L53/00; C08L63/00; C08L87/00; H05K1/03; (IPC1-7): C08G59/40; C08L53/00; C08L63/00; C08L87/00; H05K1/03
Domestic Patent References:
JP258885A | ||||
JP258897A | ||||
JP4370111A | ||||
JP4314722A | ||||
JP4311718A | ||||
JP4311716A | ||||
JP2328116A | ||||
JP4337315A |
Attorney, Agent or Firm:
Mamoru Takeuchi