Title:
【発明の名称】半導体基板の製造方法
Document Type and Number:
Japanese Patent JP3024193
Kind Code:
B2
Inventors:
Osamu Horikago
Application Number:
JP26678490A
Publication Date:
March 21, 2000
Filing Date:
October 04, 1990
Export Citation:
Assignee:
NEC
International Classes:
H01L21/322; H01L21/02; H01L27/12; (IPC1-7): H01L21/322; H01L27/12
Domestic Patent References:
| JP2228061A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)