Title:
【発明の名称】半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP3068439
Kind Code:
B2
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Inventors:
Toshio Wada
Application Number:
JP14088195A
Publication Date:
July 24, 2000
Filing Date:
June 07, 1995
Export Citation:
Assignee:
Nippon Foundry Co., Ltd.
International Classes:
H01L29/41; H01L21/76; H01L29/78; (IPC1-7): H01L21/76; H01L29/41; H01L29/78
Domestic Patent References:
| JP60206040A | ||||
| JP2168666A | ||||
| JP61252645A | ||||
| JP555361A | ||||
| JP799237A | ||||
| JP513563A |
Attorney, Agent or Firm:
Masatake Shiga (2 outside)