Title:
【発明の名称】基板からのエッチング製品を分離する方法とその装置
Document Type and Number:
Japanese Patent JP3073230
Kind Code:
B2
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Inventors:
Takuo Tate
Kenji Obara
Kenji Obara
Application Number:
JP32980890A
Publication Date:
August 07, 2000
Filing Date:
November 30, 1990
Export Citation:
Assignee:
Nippon Filcon Co., Ltd.
International Classes:
G01N3/34; B26F3/00; C23F1/00; C23F1/02; (IPC1-7): C23F1/00; B26F3/00
Domestic Patent References:
| JP2197584A | ||||
| JP62282899A |
Attorney, Agent or Firm:
Hideo Watanabe