Title:
【発明の名称】ハロゲン化物質使用の銅エッチング工程
Document Type and Number:
Japanese Patent JP3105547
Kind Code:
B2
Abstract:
An etch process for etching copper layers that is useable in integrated circuit fabrication is disclosed which utilizes halides to react with copper, preferrably using photoenergizing and photodirecting assistance of high intensity ultraviolet light, to produce a product which is either volatile or easily removed in solution. The process is anisotropic.
Inventors:
Monte A. Douglas
Application Number:
JP40445790A
Publication Date:
November 06, 2000
Filing Date:
December 20, 1990
Export Citation:
Assignee:
Texas Instruments Incorporated
International Classes:
H01L21/302; C23F4/02; H01L21/3205; H01L21/3213; H01L23/52; H05K3/06; (IPC1-7): H01L21/3213; H01L21/306; H01L21/3205; H05K3/06
Domestic Patent References:
| JP1257396A | ||||
| JP60187026A |
Attorney, Agent or Firm:
Akira Asamura (3 outside)