Title:
LEDと放熱シートとの結合構造
Document Type and Number:
Japanese Patent JP3131390
Kind Code:
U
Abstract:
A combination assembly of LED and heat sink includes a heat sink having a substrate and a plurality of fins, a circuit board provided on the substrate and at least one LED unit provided on the heat sink and electrically connected to the circuit board. The heat of the LED unit may be transmitted to the heat sink directly for heat transmission. The present invention has a greater heat transmission efficiency.
More Like This:
| JPH11305694 | SIGNAL DISPLAY DEVICE |
Inventors:
Rei Yoi
Application Number:
JP2007000590U
Publication Date:
May 10, 2007
Filing Date:
February 05, 2007
Export Citation:
Assignee:
Taishou Electronics Co., Ltd.
International Classes:
H01L33/48; H01L33/54; H01L33/56; H01L33/62; H01L33/64
Attorney, Agent or Firm:
Masaki Hattori