Title:
【発明の名称】球状充填材及びそれを用いた半導体封止用樹脂組成物
Document Type and Number:
Japanese Patent JP3143219
Kind Code:
B2
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Inventors:
Suguru Kawasaki
Masaaki Obata
Masaaki Obata
Application Number:
JP20185392A
Publication Date:
March 07, 2001
Filing Date:
July 07, 1992
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
C08K3/40; C08G59/00; C08K3/34; C08K7/16; C08K7/20; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08K7/20; C08K3/40; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP1115940A | ||||
| JP48740A | ||||
| JP1261435A | ||||
| JP5117543A |
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