Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3153560
Kind Code:
B2
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Inventors:
上田 大助
板倉 啓二郎
板倉 啓二郎
Application Number:
JP10241491A
Publication Date:
April 09, 2001
Filing Date:
May 08, 1991
Export Citation:
Assignee:
松下電子工業株式会社
International Classes:
H01L21/28; H01L21/338; H01L29/812; (IPC1-7): H01L21/338; H01L29/812
Attorney, Agent or Firm:
岩橋 文雄 （外２名）