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Title:
【発明の名称】湿式エッチング法及び組成物
Document Type and Number:
Japanese Patent JP3173730
Kind Code:
B2
Abstract:
A wet-etch composition for polyamic acids and partially cured polyamic acids comprising an aqueous solution having a major portion of water, a substituted hydrocarbon solvent and a non-ionic base that is strong enough to deprotonate the polyamic acid or a partially cured polyamic acid in a weight ratio of 0.1-49:49-0.1, with the proviso that the composition contains less than 1.0 percent ionic base. The present invention further provides a process for wet-etching polyamic acids or partially cured polyamic acids.

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Inventors:
Douglas Eritsk Fujiyar
Allison Gene Biular
Cynthia Ann Naber
Application Number:
JP6776791A
Publication Date:
June 04, 2001
Filing Date:
March 08, 1991
Export Citation:
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Assignee:
BP Amoko Corporation
International Classes:
C08J7/12; C09K13/00; G03F7/40; H01L21/308; H01L21/311; (IPC1-7): H01L21/308; C08J7/12
Domestic Patent References:
JP1120557A
JP5127464A
JP5349071A
JP5636527A
JP58103531A
JP58218124A
Attorney, Agent or Firm:
Chika Takagi (2 outside)



 
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