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Patent Searching and Data


Title:
放熱装置
Document Type and Number:
Japanese Patent JP3182697
Kind Code:
U
Abstract:
A heat sink module includes a base block having opposing top wall and bottom wall, insertion grooves located at the top wall, heat pipe grooves located at the bottom wall and rows of equally spaced holes cut through the top and bottom walls in communication between the insertion grooves and the heat pipe grooves and matching the insertion grooves, heat pipes mounted in the heat pipe grooves of the base block, and radiation fins respectively mounted in the insertion grooves of the base block, each radiation fin having heat pipe mating edges respectively inserted into the holes and stopped against the heat pipes for dissipating heat from the heat pipes.

Inventors:
Yellow
Application Number:
JP2013000362U
Publication Date:
April 04, 2013
Filing Date:
January 25, 2013
Export Citation:
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Assignee:
Yellow
International Classes:
F28D15/02
Attorney, Agent or Firm:
Masaki Hattori