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Title:
発光ダイオード装置およびリードフレーム板
Document Type and Number:
Japanese Patent JP3185994
Kind Code:
U
Abstract:
A light-emitting device in one embodiment comprises a lead frame, an adhesive, and a light-emitting element. The lead frame comprises two conductive members. The two conductive members are separated by a gap. Each conductive member comprises an upper surface and a lower surface. The upper surface and the lower surface are opposite to each other. The adhesive fills the gap and partially covers the upper and lower surfaces of each conductive member. The light-emitting element is disposed on the upper surface of one conductive member. The light-emitting element electrically connects the two conductive members.

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Inventors:
Phone Ya-Ching
Application Number:
JP2013003778U
Publication Date:
September 12, 2013
Filing Date:
July 02, 2013
Export Citation:
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Assignee:
DOW CORNING TAIWAN INC
International Classes:
H01L33/62
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma



 
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