Title:
【発明の名称】薄板縁部の加工方法および加工機
Document Type and Number:
Japanese Patent JP3334609
Kind Code:
B2
Abstract:
A method for processing a peripheral portion of a thin plate, comprises the steps of; contacting the thin plate with a processing part of a tool, which has a round free end and projects to the thin plate in order to process the contacted peripheral portion of the thin plate, and moving at least one selected from the tool and the thin plate in a direction of the other, which is parallel to a main surface of the thin plate and in a direction of the other, which is normal to the main surface of the thin plate, in order to change one contacting point between the peripheral portion of the thin plate and the processing part of the tool to another contacting point and to process the changed contacting point of the peripheral portion of the thin plate.
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Inventors:
Kouichi Tanaka
Application Number:
JP14993498A
Publication Date:
October 15, 2002
Filing Date:
May 29, 1998
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B9/00; B24B1/00; B24B9/06; B24D5/02; H01L21/304; (IPC1-7): H01L21/304; B24B9/00
Domestic Patent References:
| JP11207585A | ||||
| JP7245280A | ||||
| JP5102111A | ||||
| JP2292164A | ||||
| JP1138554U |
Attorney, Agent or Firm:
Yoshio Arafune (1 person outside)